US ITC gaw daw mi hpe daw garan nna dawdan ai lam 337 sawk sagawn ai lam hta n-gun rawng ai arung arai ni hpe gram lajang ai lam

 

2025 ning August shata 11 ya shani hta, US Mungkan Sut Masa Komishin (ICT) gaw ndau laika shapraw ai shaloi, 337 sawk sagawn ai hta, hkam kaja lam hte seng ai arung arai nkau mi hte shanhte a subassemblies ni hte seng nna, daw mi hpang jahtum dawdan ai lam galaw wa sai. Bai maram yu ngut ai hpang, US Registered Patent hpe tawt lai ai arung arai ni a matu, n-gun madun ai lam hpe n-gun jaw ai lam hpe n-gun jaw ai lam hpe n-gun jaw ai lam n nga ai. Dai aten hta, US A 100% bond ni hpe dut shabra na, dut shabra na, dut shabra na matu, shanglawm ai hpaga hpung law law hpe mung, gumsan magam a bai maram yu ai aten laman, US de dut shabra ai arung arai ni hpe mung, n law htum garan ginhka ai lam galaw ai, dai hpang, sawk sagawn ai lam hpe jahkring kau ai. Ndai tara jeyang ai lam gaw, seng ang ai patent tawt lai ai lam hta shang lawm ai hkam kaja lam hte seng ai arung arai hpaga hpung ni a US hte seng ai bungli ni hpe grai hkra machyi shangun na re, dai hta n-ga, patent hkan sa ai lam hte seng nna mungkan ting na hkum hkrang shamu shamawt lam hte seng ai arung arai hpaga lam a matu sadi jaw ai lam langai hku nna mung galaw ya ai, hpaji masa hparan hpareng ai lam hte hkrit tsang hpa hpe makawp maga ai lam hpe n-gun shaja na matu hpaga hpung ni hpe shadum ya ai.